Multi-Project Wafers (MPW) are a cost-effective way to produce (IC) integrated circuits. By sharing a single wafer with other customers, multi project wafers can help you save money on the fabrication process. 

Convert your FPGA design into 25sqmm or 6.25sqmm packaged ASICs / SIPs in any volume in less than 6 months, including design time. We have automation and run high priority shuttles.

Price includes packaging, automated analog and digital tools, and a full time support person. No layout nor CAD people needed.

*Please note the application deadlines listed in the chart below. To apply for the run, please submit your application by the deadlines shown.